Resin composition, insulating matrix comprising the same and circuit board using the same
US10280250B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Nov 30, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Dec 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/05
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition, an insulating matrix comprising the same and a circuit board using the same. The resin composition of the present invention comprises: a cross-linked polymer formed by a diamine unit containing an imide group, which is represented by the following formula (1), and an isocyanate unit represented by the following formula (2): wherein, R1, R2, A, X and a are defined in the specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.