Method for manufacturing flexible electrical device
US10280339B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 12, 2017 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Oct 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a flexible electrical device is provided and includes the following steps. A carrier substrate is provided. A releasing layer is formed on the carrier substrate. A flexible substrate is formed on the releasing layer. The flexible substrate has a first surface facing the releasing layer and a second surface opposite to the first surface. The flexible substrate is not in contact with the carrier substrate. A device layer is formed on the flexible substrate. The device layer has a third surface facing the flexible substrate and a fourth surface opposite to the third surface. The flexible substrate is separated from the releasing layer, and the releasing layer remains on the carrier substrate. Accordingly, the releasing layer and the carrier substrate can be recycled for forming another flexible electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.