Encapsulation of a stiffener layer in aluminum
US10280516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2014 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The described embodiments relate to methods and apparatus for increasing rigidity of a metal housing while maintaining or reducing a wall thickness of the metal housing. More particularly a method for embedding a stiffener layer within an aluminum substrate is discussed. In one exemplary embodiment the stiffener layer can be a carbon fiber sheet applied to an inside surface of an unfinished housing and then subsequently covered by depositing a layer of aluminum over the carbon fiber in a solid-state deposition process. The deposited aluminum can adhere to the unfinished housing around or through the carbon fiber layer to bond with the unfinished housing. Deposition parameters can be controlled to prevent damage to the carbon fiber sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.