Pressure sensor and manufacture method thereof
US10281350B2 · kind B2 · utility
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1References
24Claims
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Assignee
Inventor
Key dates
| Filing date | Aug 16, 2017 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Aug 16, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor includes a bearing region and a frame which is spatially separated from the bearing region, wherein a sensing element of the pressure sensor is produced on the bearing region. When the aforementioned pressure sensor is mounted on a package substrate, the stress from the package substrate or a circuit board can be isolated by a space between the bearing region and the frame to avoid unexpected deformation on the sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.