Wiring board including multiple wiring layers
US10283446B2 · kind B2 · utility
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7Claims
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Assignee
Inventors
Key dates
| Filing date | May 1, 2017 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | May 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board includes a base board and a plurality of wiring layers formed of a resin insulating film on the base board, wherein at least one of the wiring layers includes a fine wiring, a barrier film, which is not in contact with the fine wiring, is formed at a more outer side from the base board than the wiring layer including the fine wiring, and different types of resin insulating films are used for a wiring layer at an inner side of the barrier film close to the base board and a wiring layer at an outer side of the barrier film, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.