Microelectronic circuits and integrated circuits including a non-silicon substrate

US10283582B2 · kind B2 · utility

Assignee

• Analog Devices Global Unlimited Company · BM

Inventors

• Bernard Patrick Stenson · Limerick, IE
• Michael Noel Morrissey · Limerick, IE
• Seamus A. Lynch · Murroe, IE

Key dates

• Filing date: Feb 25, 2013
• Grant date: May 7, 2019
• Expiry date: Aug 29, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/692

Abstract

A microelectronic circuit having at least one component adjacent a carrier that is not a semiconductor or sapphire. The circuit includes a component bearing stack of one or more layers having one or more passive components, which are adjacent or bonded to the carrier. In certain embodiments, the circuit also includes an etch stop layer of a material having a slower etch rate than silicon and a bond layer bonding the carrier and the component bearing one or more layers.