Optoelectronic semiconductor component, optoelectronic arrangement and method of producing an optoelectronic semiconductor component

US10283686B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Korbinian Perzlmaier · Regensburg, DE
• Anna Kasprzak-Zablocka · Donaustauf, DE
• Stefanie Rammelsberger · Zeitlarn, DE
• Julian Ikonomov · Neutraubling, DE

Key dates

• Filing date: Jan 11, 2016
• Grant date: May 7, 2019
• Expiry date: Jan 11, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip; and an electrical connection point that contacts the optoelectronic semiconductor chip, wherein the electrical connection point covers the optoelectronic semiconductor chip on the bottom thereof at least in some areas, the electrical connection point includes a contact layer facing toward the optoelectronic semiconductor chip, the electrical connection point includes at least one barrier layer arranged on a side of the contact layer facing away from the optoelectronic semiconductor chip, the electrical connection point includes a protective layer arranged on the side of the at least one barrier layer facing away from the contact layer, the layers of the electrical connection point are arranged one on top of another along a stack direction, and the stack direction runs perpendicular to a main extension plane of the optoelectronic semiconductor chip.