Packaging structure for OLED device and display apparatus

US10283733B2 · kind B2 · utility

Assignees

• BOE Technology Group Co., Ltd. · CN
• Ordos Yuansheng Optoelectronics Co., Ltd. · CN

Inventors

• Ang Xiao · Beijing, CN
• Hyun Chel Shin · Beijing, CN
• Quanqin Sun · Beijing, CN
• Xiangnan Wang · Beijing, CN
• Fuyi Cui · Beijing, CN

Key dates

• Filing date: Aug 11, 2016
• Grant date: May 7, 2019
• Expiry date: Aug 11, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/00

Abstract

A packaging structure for an OLED device is provided. The packaging structure includes a plurality of films coated on an outer side of the OLED device and comprising alternately stacked inorganic layers and organic layers, wherein both a film in contact with the OLED device and a film farthest from the OLED device are inorganic layers, wherein the inorganic layer in contact with the OLED device comprises at least two sub-films sequentially stacked, and wherein a contact angle between i) a material for forming a sub-film of the at least two sub-films that contacts an organic layer and ii) an organic material for forming the organic layer is smaller than a preset angle.