Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die
US10284146B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Dec 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/21106
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An embodiment of a Doherty amplifier module includes a substrate, a first amplifier die, and a second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input RF signal to produce an amplified first RF signal. The second amplifier die includes one or more second power transistors configured to amplify, along a second signal path, a second input RF signal to produce an amplified second RF signal. The first and second amplifier die each also include an elongated output pad that is configured to enable a pluralities of wirebonds to be connected in parallel along the length of the elongated output pad so that the pluralities of wirebonds extend in perpendicular directions to the first and second signal paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.