Temperature compensated surface acoustic wave device and methods of manufacturing the same
US10284176B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2015 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jul 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/06
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may provide a surface acoustic wave (SAW) device, methods of fabricating the SAW device, and a system incorporating the SAW device. The SAW device may include a piezoelectric substrate and individual resonators may be formed by a plurality of electrodes on the surface of the piezoelectric substrate. A dielectric layer having a positive thermal coefficient of frequency (TCF) may be formed on each of the plurality of electrodes. In various embodiments, temperature compensation may be achieved by providing more or less of the dielectric layer on at least one resonator than on the other resonators based on a configuration of the resonators. In various embodiments, temperature compensation may be achieved by providing at least one resonator with a different duty factor than the other resonators based on a configuration of the resonators.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.