Flexible printed circuit board and method for manufacturing same
US10285260B2 · kind B2 · utility
0Cited by
8References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 30, 2015 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Oct 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.