Sensor device having printed circuit board substrate with built-in media channel
US10285275B2 · kind B2 · utility
1Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2017 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.