Component mounter
US10285317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2015 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board held by a board holding plate is heated by a heater, and after performing mounting processing of components in a region of the mounting regions of the board, a pressing process of using a pressing head to apply pressure to all the components mounted in the region at once while heating the board is performed, and a next mounting process of mounting components in a next region is performed while performing the pressing process. By performing the pressing process and the mounting process in parallel, waiting time for each process in the cycle of the mounting process and the pressing process is reduced, such that overall work time is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.