Lead-free solder alloy composition and method for preparing lead-free solder alloy
US10286498B2 · kind B2 · utility
3Cited by
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Key dates
| Filing date | Aug 18, 2015 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Dec 24, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.