Molding apparatus and molding method
US10286615B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2012 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | May 26, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A lens molding apparatus (100) of the present invention includes: a mold (1) having a transfer surface (1a); a mold (2) having a transfer surface (2a); heating devices (3a and 3b) for curing, by heating, a resin material which is supplied to the transfer surface (1a) and against which the transfer surface (2a) is pressed; a pressure control section (6) for controlling a support device (4) so that the support device (4) applies a pressure on the resin material; and a DC power source (7) for forming an electric field by applying a voltage between the molds (1 and 2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.