Conductors integrated in a watertight manner in sandwich components
US10286622B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for manufacturing a sandwich component having a first and a second flat side, in a pre-assembly state all components of the sandwich component in relation to one another are placed in a nominal position: at least one shape-imparting structural layer and a conductor layer having an electrical conductor, and are connected in an assembly step with an adhesive, wherein in the pre-assembly state on both sides of the conductor layer two barrier layers which are vapor-tight are placed as further components and interconnected in such a manner that said two barrier layers enclose the conductor in a vapor-tight manner. A sandwich component having flat sides, manufactured according to the above method, has at least the structural layer and the conductor layer with the conductors, said structural and conductor layers being disposed between the flat sides and connected with the adhesive, and on both sides of the conductor layer the barrier layers as further components are interconnected in such a manner that said two barrier layers enclose the conductor in a vapor-tight manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.