Resin film, barrier film, electrically conductive film, and manufacturing method therefor
US10287408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2015 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Oct 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2365/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a resin film having excellent size stability in a high-temperature environment. A resin film formed of a resin containing an alicyclic structure-containing polymer having crystallizability, wherein an absolute value of a thermal size change ratio when the film is heated at 150° C. for 1 hour is 1% or less in any in-plane direction of the film. The alicyclic structure-containing polymer may preferably be a hydrogenated product of a ring-opened polymer of dicyclopentadiene. Also provided is a method for producing the resin film including a step of relaxing strain of the crystallized film while the crystallized. film is kept flat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.