High performance thermal interface materials with low thermal impedance
US10287471B2 · kind B2 · utility
9Cited by
124References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 5, 2014 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.