Method for locating machining position in repair material, and repairing method
US10288584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2015 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Aug 10, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a method for locating a machining position in a repair material that is arranged on a member including a machined portion formed by predetermined machining, the method including: a step of arranging a marker including a portion having a different propagation characteristic of an ultrasonic wave from that of a peripheral portion in the machined portion existing in the member before the repair material is arranged on the member; and a step of applying the ultrasonic wave to the member covered with the repair material and locating the machining position at a position of the marker captured by the ultrasonic wave after the repair material is arranged on the member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.