Method and apparatus for forming backside die planar devices and saw filter
US10290598B2 · kind B2 · utility
6Cited by
20References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2014 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/0547
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.