Weld joint with constant overlap area
US10290616B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2018 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of the end section, such that the respective lead extends in a direction substantially perpendicular to the width of the end section. With the respective lead and the end section aligned, the respective lead is welded to the end section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.