Method for mirror-coating lateral surfaces of optical components for use in optoelectronic semiconductor bodies, and optoelectronic semiconductor body which can be mounted on surfaces
US10290782B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2016 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | May 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.