Encapsulation structure and encapsulation method, and OLED apparatus
US10290828B2 · kind B2 · utility
1Cited by
4References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 7, 2016 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Apr 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
Abstract
A package structure, a packaging method and an organic light-emitting diode (OLED) device are provided. The package structure includes a first substrate and a second substrate which are arranged opposite to each other, and a sealant portion which is disposed between the first substrate and the second substrate, a first enclosed cavity being encircled by the first substrate, the second substrate and the sealant portion; a structure to be packaged being disposed in the first enclosed cavity; and a second enclosed cavity being disposed in the sealant portion and filled with hydrophobic liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.