Method of producing an electronic component

US10290997B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Jens Mueller · Stuttgart, DE
• Christoph Stephan · Pfalzgrafenweiler, DE
• Robert Walter · Parsberg, DE
• Stefan Hartauer · Wolfsegg, DE
• Christian Rumbolz · Lappersdorf, DE

Key dates

• Filing date: Feb 18, 2016
• Grant date: May 14, 2019
• Expiry date: Feb 18, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S2301/176
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.