Expanding thermal device and system for effecting heat transfer within electronics assemblies
US10292255B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2016 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | May 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10507
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.