Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US10292265B2 · kind B2 · utility
5Cited by
1References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 8, 2015 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Nov 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.