Ultrasonic probe and manufacturing method thereof
US10292680B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 23, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S15/8915
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.