Patent · US Active

Use of phosphonic acid diesters and diphosphonic acid diesters and thermally curable mixtures containing phosphonic acid diesters and diphosphonic acid diesters

US10294389B2 · kind B2 · utility

0Cited by
20References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 21, 2006
Grant dateMay 21, 2019
Priority date
Expiry dateOct 11, 2026

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L61/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Disclosed herein is a thermally curable mixture, comprising at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A); and at least one compound (B) which can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacctalization of N-alkoxyalkylamino groups, acctalization of N-hydroxyalkylamino groups, or a combination thereof. Also disclosed is a process for making the thermally curable mixture, and a cured material comprising the product of thermally curing the mixture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.