Use of phosphonic acid diesters and diphosphonic acid diesters and thermally curable mixtures containing phosphonic acid diesters and diphosphonic acid diesters
US10294389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2006 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein is a thermally curable mixture, comprising at least one phosphonic diester (A), at least one diphosphonic diester (A), or at least one phosphonic diester and at least one diphosphonic diester (A); and at least one compound (B) which can be reacted by transesterification, transamidation, self-condensation of N-hydroxyalkylamino groups, self-condensation of N-alkoxyalkylamino groups, transacctalization of N-alkoxyalkylamino groups, acctalization of N-hydroxyalkylamino groups, or a combination thereof. Also disclosed is a process for making the thermally curable mixture, and a cured material comprising the product of thermally curing the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.