Pressure sensitive adhesive tape with microstructured elastomeric core
US10294394B2 · kind B2 · utility
0Cited by
26References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | May 1, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Multilayer adhesive tapes including at least one microstructured elastomeric layer and at least one layer of a pressure sensitive adhesive disposed on the microstructured elastomeric layer, and articles that include such multilayer adhesive tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.