Electroless copper plating polydopamine nanoparticles
US10294567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jul 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.