Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 · kind B2 · utility
1Cited by
12References
9Claims
0Family size
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Key dates
| Filing date | Jul 13, 2018 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jul 13, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.