Method of providing a high density test contact solution
US10295566B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2851
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A flexible probe card according to the present invention includes a compression layer; a transport layer coupled to the compression layer; and a contact layer coupled to the transport layer. The compression layer is formed of encapsulated closed cell polyurethane foam. The transport layer includes connectors for coupling the flexible probe card to a tester. The contact interface layer includes embedded conductive wires placed in a fixed grid pattern in a silicon rubber layer, without a specific connector pattern associated either with the transport layer or a device under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.