Gold or platinum target, and production method for same
US10297430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3491
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method of producing a target having a small average crystal grain size of gold or platinum and having a uniform crystal grain size in an in-plane direction of a target surface and a thickness direction of the target in order to further stabilize film deposition characteristics during sputtering. The method for producing a gold or platinum target includes an ingot production step for casting molten gold or platinum to obtain an ingot; a primary forging step for forging the ingot in a first temperature range; a step for cooling the primary forged ingot to a second temperature range lower than the first temperature range; a secondary forging step for determining six directions for the cooled primary forged ingot and further forging the cooled primary forged ingot from the six directions in the second temperature range; a cross-rolling processing step for adjusting the temperature of the secondary forged ingot to a third temperature range and subjecting the secondary forged ingot to cross-rolling processing to form the secondary forged ingot into a target shape; and a heat treatment step for heat-treating the target-shaped ingot in a fourth temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.