Method for producing an electronic component and electronic component
US10297469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2014 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.