Patent · US Active

Method for producing an electronic component and electronic component

US10297469B2 · kind B2 · utility

0Cited by
13References
18Claims
0Family size

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Key dates

Filing dateNov 13, 2014
Grant dateMay 21, 2019
Priority date
Expiry dateNov 13, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.