Sacrificial layer for platinum patterning

US10297497B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Sebastian Meier · Munich, DE
• Helmut Rinck · Moosburg an der Isar, DE
• Kai-Alexander Schachtschneider · Rohrbach, DE
• Fromund Metz · Marzling, DE
• Mario Schmidpeter · Munich, DE
• Javier Gustavo Moreira · Weimar, DE

Key dates

• Filing date: Jul 24, 2017
• Grant date: May 21, 2019
• Expiry date: Jul 24, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/53242
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In accordance with at least one embodiment of the disclosure, a method of patterning platinum on a substrate is disclosed. In an embodiment, an adhesive layer is deposited over the substrate, a sacrificial layer is deposited over the adhesive layer, and a patterned photoresist layer is formed over the sacrificial layer. Then, the sacrificial layer is patterned utilizing the photoresist layer as a mask such that at least a portion of the adhesive layer is exposed. Subsequently, the top and sidewall surfaces of the patterned sacrificial layer and the first portion of the adhesive layer are covered by a platinum layer. Finally, the sacrificial layer and a portion of the platinum layer covering the top and sidewall surfaces of the sacrificial layer are etched, thereby leaving a remaining portion of the platinum layer to form a patterned platinum layer on the substrate.