Method for preparing ceramic package substrate with copper-plated dam
US10297498B2 · kind B2 · utility
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Key dates
| Filing date | Dec 7, 2016 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for preparing a ceramic package substrate with a copper-plated dam involves making a circuit layer on a ceramic base by performing thin film metallization, dry film application, exposure, development, copper plating, and evening, and then forming copper-plated dams that circle individual circuits by repeatedly applying dry film application, exposure, development, and electroplating for thickening, so as to obtain the ceramic package substrate with the copper-plated dam. Circuits made using the method feature for high dimensional precision, high line resolution, and high surface evenness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.