Base plate for heat sink as well as heat sink and IGBT module having the same
US10297525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2016 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D12/411
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N<650.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.