Patent · US Active

Discrete flexible interconnects for modules of integrated circuits

US10297572B2 · kind B2 · utility

9Cited by

86References

16Claims

0Family size

Assignee

MC10, INC. · US

Inventors

Mitul Dalal · Grafton, US
Sanjay Gupta · Crystal Lake, US

Key dates

Filing date	Sep 30, 2015
Grant date	May 21, 2019
Priority date	—
Expiry date	Apr 9, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K1/189
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.