Three-dimensional package structure and the method to fabricate thereof
US10297573B2 · kind B2 · utility
1Cited by
0References
18Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 22, 2018 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Feb 5, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional package structure, comprising: a substrate; a first plurality of discrete electronic components disposed over the bottom surface of the substrate, wherein a first insulating layer is disposed over the bottom surface of the substrate to encapsulate the first plurality of discrete electronic components, wherein at least one second insulating layer is disposed over the first insulating layer, wherein a plurality of surface-mount pads are disposed on the bottom surface of the at least one second insulating layer and electrically connected to at least one via disposed in the at least one second insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.