Light emitting package having phosphor layer over a transparent resin layer
US10297725B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.