Molded package for light emitting device
US10297728B2 · kind B2 · utility
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 19, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Jun 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.