Patent · US Active

LED device, method for manufacturing an LED device, and LED display module

US10297730B2 · kind B2 · utility

1Cited by
1References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 17, 2017
Grant dateMay 21, 2019
Priority date
Expiry dateNov 17, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/0364
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.