LED device, method for manufacturing an LED device, and LED display module
US10297730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.