Bulk acoustic wave resonator and method of manufacturing the same
US10298197B2 · kind B2 · utility
9Cited by
1References
25Claims
0Family size
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Key dates
| Filing date | Apr 14, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Sep 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/173
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A bulk acoustic wave resonator includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.