Image capturing device and method of manufacturing the same
US10298822B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image capturing device includes a substrate, a black matrix layer, an anti-reflection layer, a counter substrate, a sealant, a plurality of spacers and a photo-sensitive component. The black matrix layer is disposed on the substrate. The black matrix layer has a via exposing a portion of the substrate. The anti-reflection layer covers the via of the black matrix layer. The counter substrate is disposed opposite to the substrate. The counter substrate has an opening, and a orthographic projection of the opening onto the black matrix layer is overlapped with the anti-reflection layer and a portion of the black matrix layer surrounding the via. The sealant is disposed between the counter substrate and the substrate. The spacers are disposed over the portion of the black matrix layer surrounding the via. The photo-sensitive component is disposed at the opening of the counter substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.