Mid-spreader for stacked circuit boards in an electronic device
US10299405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2017 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Oct 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.