Patent · US Active

Cooling structures for additive manufacturing

US10300530B2 · kind B2 · utility

2Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 2017
Grant dateMay 28, 2019
Priority date
Expiry dateDec 11, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

This disclosure provides systems and tooling for cooling components during additive manufacturing. A build plate supports layers of powdered materials as they are positioned and selectively fused to create the component. The build plate defines a build surface and the build surface retracts in a working direction opposite a build direction for the component. At least one vertical cooling structure is provided perpendicular to the build plate and protruding from the build plate as the build surface retracts. The vertical cooling structure cools at least a portion of the component through unfused powdered materials between the vertical cooling structure and the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.