Wafer alignment method and system
US10300554B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Wafers are aligned with one another by reference to features formed on or in each wafer. Notches are formed in each wafer, including a pivot-notch that allows for two-point contact, and a stop-notch that provides for single-point contact. A bias-notch is formed for pressing the wafers into engagement with the two-contact element when it is in the pivot-notch and with the single-contact element when it is in the stop-notch. The wafers may be bonded to one another to maintain the alignment of the referenced features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.