Patent · US Active

Laser cutting machine and method for cutting workpieces of different thicknesses

US10300555B2 · kind B2 · utility

1Cited by

3References

13Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Tim Hesse · Ditzingen, DE
Tobias Kaiser · Rutesheim, DE

Key dates

Filing date	Apr 17, 2015
Grant date	May 28, 2019
Priority date	—
Expiry date	Apr 22, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/38
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A laser cutting machine for cutting a workpiece having a first thickness (using a first processing laser beam having a first laser beam characteristic and a workpiece having a different second thickness using at least a second processing laser beam having a different second laser beam characteristic includes a laser source for producing a unprocessed laser beam having a laser wavelength of less than 4 μm, a device which forms from the unprocessed laser beam the processing laser beams, and a control unit which controls the device in dependence on the thickness of the workpiece to be cut.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.