Hybrid substrate processing
US10300557B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Sep 22, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A hybrid laser modulation and acid etch process for the creation of a patterned substrate. According to some embodiments, a hole is formed in a glass substrate by first modulating a portion of the substrate in the desired shape. A mask is coated on the glass substrate and is patterned to expose the modulated portion. The glass substrate is then acid etched to remove the modulated portion. Once the modulated portion has been etched, the desired shape may be removed from the glass substrate and the mask may be stripped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.