Laser processing machine and laser cutting method
US10300558B2 · kind B2 · utility
1Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2016 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Apr 26, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/142
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing machine includes a laser oscillator. The laser oscillator excites a laser beam having a wavelength in a 1 μm band or a shorter wavelength band. One process fiber transmits the laser beam emitted from the laser oscillator. A focusing optical element focuses, when a workpiece is irradiated with the laser beam emitted from the process fiber, the laser beam on a plurality of spots in a unit area within a unit time, the unit area having a radius of 0.5 mm of an optical axis of the laser beam, and the unit time being a time from when the workpiece starts to melt to when the melting of the workpiece ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.